Bioh Kim: search on Z-Library

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1

Through-Silicon-Via Copper Deposition for Vertical Chip Integration

Journal:

MRS Proceedings

Year:

2006

Language:

english

File:

PDF, 2.27 MB

english, 2006

2

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Factors Affecting Copper Filling Process Within High Aspect Ratio Deep Vias for 3D Chip Stacking

Bioh Kim,, Sharbono, C., Ritzdorf, T., Schmauch, D.

Year:

2006

Language:

english

File:

PDF, 3.47 MB

english, 2006

3

[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Fast copper plating process for TSV fill

Yun Zhang,, Richardson, Thomas, Chung, Stream, Chen Wang,, Bioh Kim,, Rietmann, Christian

Year:

2007

Language:

english

File:

PDF, 233 KB

english, 2007

4

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - New technologies for advanced high density 3D packaging by using TSV process

Kettner, Paul, Kim, Bioh, Pargfrieder, Stefan, Swen Zhu,

Year:

2008

Language:

english

File:

PDF, 990 KB

english, 2008

5

Electrical Waveform Mediated Through-Mask Deposition of Solder Bumps for Wafer Level Packaging

Kim, Bioh, Ritzdorf, Tom

Journal:

Journal of The Electrochemical Society

Year:

2004

Language:

english

File:

PDF, 1.09 MB

english, 2004

6

[ECS 209th ECS Meeting - Denver, Colorado (May 7-May 12, 2006)] ECS Transactions - Back-End Copper Metallization for Advanced Packaging

Kim, Bioh, Sharbono, Charles, Ritzdorf, Tom, Schmauch, Dan

Year:

2007

Language:

english

File:

PDF, 1.52 MB

english, 2007

7

ECS Transactions [ECS China Semiconductor Technology International Conference 2010 (CSTIC 2010) - Shanghai, China (March 18 - March 19, 2010)] - Cu-Cu Thermo-Compression Bonding for TSV Integration

Kim, Bioh, Matthias, Thorsten, Burgstaller, Daniel, Zhu, Swen, Kettner, Paul, Jang, Eun-Jung, Kim, Jae-Won, Park, Young-Bae

Year:

2010

Language:

english

File:

PDF, 3.52 MB

english, 2010

8

Electrochemically Deposited Tin-Silver-Copper Ternary Solder Alloys

Kim, Bioh, Ritzdorf, Tom

Journal:

Journal of The Electrochemical Society

Year:

2003

Language:

english

File:

PDF, 2.04 MB

english, 2003

9

Electrodeposition of Near-Eutectic SnAg Solders for Wafer-Level Packaging

Kim, Bioh, Ritzdorf , Tom

Journal:

Journal of The Electrochemical Society

Year:

2003

Language:

english

File:

PDF, 2.18 MB

english, 2003

10

[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - Advanced wafer bonding solutions for TSV integration with thin wafers

Kim, Bioh, Matthias, Thorsten, Wimplinger, Markus, Lindner, Paul

Year:

2009

Language:

english

File:

PDF, 1.67 MB

english, 2009

11

[ASME ASME 2010 International Mechanical Engineering Congress and Exposition - Vancouver, British Columbia, Canada (November 12–18, 2010)] Volume 4: Electronics and Photonics - Comparison of Enabling Wafer Bonding Techniques for TSV Integration

Kim, Bioh, Matthias, Thorsten, Wimplinger, Markus, Kettner, Paul, Lindner, Paul

Year:

2010

Language:

english

File:

PDF, 1.27 MB

english, 2010

12

Annealing temperature effect on the Cu-Cu bonding energy for 3D-IC integration

Eun-Jung Jang, Jae-Won Kim, Bioh Kim, Thorsten Matthias, Young-Bae Park

Journal:

Metals and Materials International

Year:

2011

Language:

english

File:

PDF, 1.06 MB

english, 2011

13

[IEEE 2002 8th International Advanced Packaging Materials Symposium - Stone Mountain, GA, USA (3-6 March 2002)] 2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617) - High rate electrodeposition of near-eutectic PbSn solders

Bioh Kim,, Sharbono, C., Ritzdorf, T.

Year:

2002

Language:

english

File:

PDF, 1.17 MB

english, 2002

14

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Thin wafer handling and processing-results achieved and upcoming tasks in the field of 3D and TSV

Kettner, Paul, Burggraf, Jurgen, Kim, Bioh

Year:

2009

Language:

english

File:

PDF, 593 KB

english, 2009

15

[IEEE 2002 8th International Advanced Packaging Materials Symposium - Stone Mountain, GA, USA (3-6 March 2002)] 2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617) - Electrodeposition of ternary near-eutectic SnAgCu solders with an alkaline bath

Bioh Kim,, Ritzdorf, T.

Year:

2002

Language:

english

File:

PDF, 975 KB

english, 2002

16

Bulletin Board

Bioh Kim,, Ritzdorf, T.

Journal:

Music Educators Journal

Year:

1971

Language:

english

File:

PDF, 309 KB

english, 1971

17

ECS Transactions [ECS China Semiconductor Technology International Conference 2011 (CSTIC 2011) - Shanghai, China (March 13 - March 14, 2011)] - Low Temperature Bonding with Thin Wafers for 3D Integration

Matthias, Thorsten, Kim, Bioh, Kettner, Paul, Wimplinger, Markus, Lindner, Paul

Year:

2011

Language:

english

File:

PDF, 494 KB

english, 2011

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